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Dae-Ho Lee

JOB OBJECTIVE

Customer Quality Engineer in foundry or assembly house

Supplier Quality Engineer in semiconductor industry

PROFESSIONAL EXPERIENCE

Process Engineer at Amkor Technology Korea located in Seoul Mar.2003~Aug.2004

Responsible for process engineering of wafer mount, Sawing, Die-attach and Wire-bonding process; abnormal lots control and disposition in production line. DOE for improvement of quality for ball shear and wire pull strength. First Article Inspection, especially for lead-frame and epoxy (Adhesive) Supporting for customer engineering and Qualification; Scribe lane feasibility test, Multi-chip package qualification for RFMD, Stacked die production for TI, Gold wire bond ability test for Intel.

Customer Quality Engineer at DongbuHiTek (Dongbu Electronics, one of foundries in Korea) located in Bucheon, Korea Jan.2005~Present

Support for customer requirement based on ISO/TS16949; Customer(mainly TI, Mediatek, Silicon Works, AOS) Audit following up, Internal Audit Following up, 8D report following up, Process Change Notification, RMA, Regular Quality Review Meeting and so on. Support for inline control; SPC summary and corrective action following up, Change control of process, material and equipments, MRB and so on

TI SCB (Sameness Control Board) Member, Certified 6sigma Green Belt

EDUCATION

B.S. Materials Science Engineering, Hanyang University in Seoul, Graduated in 2003(GPA: 3.83)

SUMMARY OF QUALIFICATIONS

Overall Experience in semiconductor industry (Assembly and Foundry)

Systematic Approach and thought for problem solving, outstanding statistical analysis

In-depth understanding of Korean semiconductor industry including fab-less

Strongly self-motivated, enthusiastic and enjoy working in any environment

Outstanding communication and presentation skills

I do here by declare that the above statement to be true and correct in every detail.